Use
on gold, silver, platinum and other metals with high melting points. Preserves temper and color of
metal and the adhesive qualities of this liquid flux hold solder in place.
For use in low temperature brazing and silver soldering ferrous and non-ferrous metals. Begins to
dissolve oxides at 800°F (427°C) and is fluid-active between 1100° and 1600°F (593° and 871°C).
Contains no fluoride.
